METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD OR A PRINTED CIRCUIT BOARD INTERMEDIATE PRODUCT, AND PRINTED CIRCUIT BOARD OR PRINTED CIRCUIT BOARD INTERMEDIATE PRODUCT

摘要

In a method for integrating at least one electronic component (31) into a printed circuit board or a printed circuit board intermediate product (37), the following steps are provided: - providing a layer (32) for at least temporarily supporting the electronic component (31), - fixing the electronic component (31) on the layer (32), - arranging a conductive layer (35) on the supporting layer (32) with at least one cutout (38) corresponding to the dimensions of the electronic component (31) to be fixed, - at least partly encapsulating or covering the component (31) fixed on the supporting layer (32) with an insulating material (36), - exposing the electronic component (31), and at least partial regions of the conductive layer (35), which adjoins the component (31) and is arranged on the supporting layer (32), and - at least partly making contact between the electronic component (31) and the conductive layer (35) adjoining the component. Furthermore, a printed circuit board (37) and a printed circuit board intermediate product having an integrated electronic component (31) are provided.