发明名称 RESIN MOLDING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin molding apparatus that enables a molded article to surely remain in an intended mold for taking out the molded article irrespective of a kind of a used resin and difference in the shape of the molded portion. <P>SOLUTION: In the resin molding apparatus, a first mold, second mold and third mold are arranged contactably/separably, a substrate 56 is sandwich-held between the second mold and the third mold, and electronic components mounted on the substrate 56 are resin-sealed by filling a resin in a cavity formed by a molding recess 38 formed in the second mold and the substrate 56 via a runner groove 16 formed in the first mold and a vertical runner hole formed through the second mold. The first mold is equipped with: a runner ejector pin 32 for thrusting out a solidified resin in the runner groove 16; and an ejector plate for the first mold, for causing the runner ejector pin 32 to operate. The second mold is equipped with a product ejector pin 42 which coordinates with the ejector plate to thrust out the resin solidified in the molding recess 38. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012143937(A) 申请公布日期 2012.08.02
申请号 JP20110003082 申请日期 2011.01.11
申请人 DAIICHI SEIKO KK 发明人 MASUDA KOSAKU;SHIMAZAKI TAKESHI;KITAMURA HIROYUKI
分类号 B29C45/40;B29C45/02;B29L31/36;H01L21/56 主分类号 B29C45/40
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