| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable chamfering of corners of a semiconductor chip that is preliminarily divided into individual pieces. <P>SOLUTION: A chamfering apparatus 10 includes: a rotating device 30 for rotating the semiconductor chip 11; tools 40 disposed around the rotating device 30 so as to be brought into contact with/be separated from the corners of the semiconductor chip 11; and a moving device 50 for moving the tools 40 along a radial direction with respect to the rotation axis of the rotating device 30 to bring the tools 40 into contact with the corners of the semiconductor chip 11, thereby chamfering the corners of the semiconductor chip 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
