发明名称 ELECTROLESS PLATING PRETREATMENT AGENT, ELECTROLESS PLATING METHOD USING SAME, AND ELECTROLESS PLATED OBJECT
摘要 It is an object of the present invention to provide an electroless plating pretreatment agent that can retain stably Pd(II) over a long period of time in an organic solvent, an electroless plating method using the same that is capable of forming an electroless plated film having excellent adhesion, and an electroless plated object. The object is achieved by an electroless plating pretreatment agent comprising an organic palladium compound and a coordination compound having a functional group with a metal-capturing capability dissolved in an organic solvent, the coordination compound being selected from the group consisting of the imidazole analogs, polyethyleneamines, ethyleneimines and polyethyleneimines.
申请公布号 US2012192758(A1) 申请公布日期 2012.08.02
申请号 US201113501139 申请日期 2011.03.14
申请人 IMORI TORU;SUZUKI JUN;MURAKAMI RYU;AIBA AKIHIRO;ITO JUNICHI 发明人 IMORI TORU;SUZUKI JUN;MURAKAMI RYU;AIBA AKIHIRO;ITO JUNICHI
分类号 C09D5/00;B05D1/18;B05D3/10 主分类号 C09D5/00
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