RESIN-ATTACHED LEAD FRAME, METHOD FOR MANUFACTURING SAME, AND LEAD FRAME

摘要

A resin-attached lead frame (10) has a plurality of die pads (LED element mounting parts) (25) and a plurality of lead parts (26) provided spaced apart from each of the die pads (25) and is provided with a lead frame main body (11) in which LED element mounting areas (14) are formed on the surface of each die pad (25) and each lead part (26). A reflective resin part (23) is provided so as to surround each LED element mounting area (14) in the lead frame main body (11). An aluminum vapor deposition layer or aluminum sputtering layer (12) is provided on the surface of each LED element mounting area (14) in the lead frame main body (11).