SENSOR CHIP COMPRISING A SPACER FOR PROTECTING THE SENSOR ELEMENT
摘要
In a method for manufacturing a sensor chip a spacer (3) is arranged at the front side (11) of a substrate (1) at which front side (11) a sensing element (2) is arranged, too. Holes (14) are etched for building vias (15) extending through the substrate (1) between the front side (11) of the substrate (1) and its back side (12). After etching, the holes (14) are filled with conductive material to complete the vias (15). The spacer (3) provides protection to the sensing element (2) and the sensing chip throughout the manufacturing process.
申请公布号
WO2012100360(A1)
申请公布日期
2012.08.02
申请号
WO2012CH00019
申请日期
2012.01.26
申请人
SENSIRION AG;GRAF, MARKUS;STREIFF, MATTHIAS;HUNZIKER, WERNER