发明名称 Folding Methods for Making Frames of Board Level Electromagnetic Interference (EMI) Shields
摘要 Disclosed herein are exemplary embodiments of methods of making frames for electromagnetic (EMI) shielding apparatus. An exemplary method generally includes forming a frame to have at least a first frame portion, a second frame portion, and a common sidewall including at least a portion shared by and connecting the first and second frame portions. The second frame portion is repositioned from being disposed within a footprint of the first frame portion to outside the footprint of the first frame portion. Another exemplary embodiment includes a frame having first and second frame portions. The second frame portion is of a size sufficient to fit within an interior region defined by the first frame portion. The first and second frame portions share at least a portion of a common sidewall having a bendable hinge portion that connects the second frame portion to the first frame portion.
申请公布号 US2012193136(A1) 申请公布日期 2012.08.02
申请号 US201113017967 申请日期 2011.01.31
申请人 VINOKUR IGOR;ENGLISH GERALD R.;KORUS ZBIGNIEW M.;LAIRD TECHNOLOGIES, INC. 发明人 VINOKUR IGOR;ENGLISH GERALD R.;KORUS ZBIGNIEW M.
分类号 H05K9/00;H05K13/00 主分类号 H05K9/00
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