| 摘要 |
<p>The present technology relates to a solid-state image pickup device, which is a compound-eye solid-state image pickup device that can pickup images with high qualities irrespective of environments under which the device is used, a method for manufacturing the solid-state image pickup device, and an electronic device. The solid-state image pickup device is provided with: photoelectric conversion units (21) that are two-dimensionally disposed; on-chip lenses (27a) that are two-dimensionally disposed above the photoelectric conversion units (21), corresponding to the photoelectric conversion units (21), respectively; microlenses (10a) that are disposed by each group of the on-chip lenses (27a) such that the microlenses face the on-chip lenses; and a transparent material layer that is composed of a first intermediate layer (29) and a second intermediate layer (31), which are sandwiched between the on-chip lenses (27a) and the microlenses (10a).</p> |
