发明名称 |
INFRARED INSPECTION OF BONDED SUBSTRATES |
摘要 |
A method and apparatus for obtaining inspection information is described. A standard CCD or CMOS camera is used to obtain images in the near infrared region. Background and noise components of the obtained image are removed and the signal to noise ratio is increased to provide information that is suitable for use in inspection. |
申请公布号 |
KR20120085916(A) |
申请公布日期 |
2012.08.01 |
申请号 |
KR20127015809 |
申请日期 |
2010.11.16 |
申请人 |
RUDOLPH TECHNOLOGIES, INC. |
发明人 |
ZHOU WEI |
分类号 |
G01N21/88;G01N21/35 |
主分类号 |
G01N21/88 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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