发明名称 Method for applying semi-dry electroplating method on surface of plastic substrate
摘要 <p>A method for applying a semi-dry electroplating method on a surface of plastic substrate is related to an electroplating method of plastic. A method for applying semi-dry electroplating method on a surface of plastic substrate, which realizes the surface metallization of plastic materials, simplifies the electroplating procedure, dramatically reduces the amount of waste water, reduces the pollution to environment and expands electroplatable range of plastic substrates, is provided. Water-free cleaning and dust removal are conducted to a plastic substrate; a first-time activated treatment is conducted to the surface of the plastic substrate; a PVD plating metallic base layer, an alloy transition layer and a metallic electrical conductive layer are applied in turn on the activated-treated surface of the plastic substrate; ultrasonic water washing and a second-time activated treatment are conducted on the treated plastic substrate; the treated plastic substrate is directly electroplated with acid copper or is moved to a nickel plating bath and conducted with nickel electroplating; the treated plastic substrate is moved to a chromium plating bath and conducted with a final chromium electroplating or is transferred to a PVD oven to conduct deposition of chromium layer.</p>
申请公布号 EP2481838(A1) 申请公布日期 2012.08.01
申请号 EP20120151844 申请日期 2012.01.19
申请人 XIAMEN RUNNER INDUSTRIAL CORPORATION 发明人 WU, ZI-BAO;QIAO, YONG-LIANG;YANG, BO;LEE, MIN-ZEN
分类号 C25D5/12;C23C14/02;C23C14/20;C23C28/02;C25D5/14;C25D5/48;C25D5/56 主分类号 C25D5/12
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