GATE STRUCTURES, METHODS OF FORMING GATE STRUCTURES, AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME

摘要

PURPOSE: A gate structure, a forming method thereof, and a method of manufacturing a semiconductor device using the same are provided to prevent an electric field from becoming concentrated on the gate structure by forming a second oxide film on a nitride film through an anisotropic plasma oxidation process. CONSTITUTION: A tunnel insulating film pattern(115) and a floating gate(125) are successively formed on a substrate(100). A first oxide film and a nitride film are successively formed on the floating gate. A dielectric layer pattern(185) is formed on the upper side and a sidewall of the floating gate and a sidewall of the tunnel insulating film pattern. The dielectric layer pattern comprises a first oxide film pattern(155), a nitride pattern(165), and a second oxide film pattern(175). A control gate(195) is formed on the dielectric layer pattern.