发明名称 Method and system for packaging a MEMS device
摘要 <p>A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate (608) and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can provide physical support for device components, such as electronic components which can be used to control the state of the display. The backplate can also be utilized as a primary structural support for the device. A desiccant (1254) is provided in the cavity formed by the transparent substrate and the backplate. </p>
申请公布号 EP2202559(A3) 申请公布日期 2012.08.01
申请号 EP20090175764 申请日期 2005.09.14
申请人 QUALCOMM MEMS TECHNOLOGIES, INC 发明人 PALMATEER, LAUREN;SAMPSELL, JEFFREY B.;MILES, MARK W.;ARBUCKLE, BRIAN W.;FLOYD, PHILIP D.
分类号 G02B26/00;B81B7/00 主分类号 G02B26/00
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