| 摘要 |
A cooling device component of monobloc design has a heat shield made from tungsten, a tungsten alloy, a graphitic material or a carbidic material provided with a through-hole. A cooling pipe for carrying coolant is joined in the through-hole. The heat shield is in turn joined or metallurgically joined to a structural part made from a material with a tensile strength at room temperature of >300 MPa and an electrical resistivity of >0.04 Ohm mm2m−1. |
