| 摘要 |
PURPOSE: A package substrate is provided to improve the performance of a semiconductor package by preventing the generation of voids in the process of forming a solder mounting unit. CONSTITUTION: The circumference of a solder mounting unit(55) is formed into one or more depression section(R1,R2,R3,R4). The depression section is composed of a curve corresponding to the edge. The depression section is composed of an arc, a curved surface or a curve extended to the center of the mounting unit. One or more depression sections are formed on the circumference of a solder to fix a chip on a circuit substrate. |
