ADHESIVE WHICH CAN BE REMOVED BY CONTROLLED HEAT TREATMENT AND EMI SHIELD FILM USING ADHESIVE

摘要

PURPOSE: A resin adhesive composition is provided to facilitate easy removal of a electromagnetic shielding film using said adhesive such that in the case of adhesive failure, it is possible to rework the electromagnetic shielding film without needing rework of a whole printed circuit board. CONSTITUTION: A resin adhesive composition comprises an epoxy resin, comprising either an epoxy resin which is capable of generating an epoxy resin with a tertiary ester bond or an epoxy resin capable of generating a tertiary ester bond after curing; a hardener; a curing accelerator; a thermoplastic resin for reforming; and a conductive particle. The comprised amount of the epoxy resin, comprising either an epoxy resin which is capable of generating an epoxy resin with a tertiary ester bond or an epoxy resin capable of generating a tertiary ester bond after curing, is 40-55 parts of a total epoxy resin of 100.0 parts, by weight.