发明名称 |
SEMICONDUCTOR LIGHT-EMITTING DEVICE AND ENCAPSULATING METHOD THEREOF |
摘要 |
A semiconductor light emitting package includes a substrate, an encapsulating material, a semiconductor light emitting chip disposed on the substrate, wires; and an integrated glass-fluorescent powder compound light-emitting structure. The encapsulating material and the integrated glass-fluorescent powder compound light-emitting structure are packaged on the semiconductor light emitting chip, the integrated glass-fluorescent powder compound light-emitting structure is coated on the encapsulating material. The semiconductor light-emitting package has a large light-emitting area, high uniformity which can effectively avoid "halo" phenomenon, and long working life. The present invention also relates to a method for manufacturing semiconductor light emitting package, which can be implemented at low temperature and improve the reliability and the stability of the light-emitting property of the compound light-emitting structure. |
申请公布号 |
EP2482351(A1) |
申请公布日期 |
2012.08.01 |
申请号 |
EP20090849671 |
申请日期 |
2009.09.25 |
申请人 |
OCEAN'S KING LIGHTING SCIENCE&TECHNOLOGY CO., LTD. |
发明人 |
ZHOU, MINGJIE;MA, WENBO;CHEN, GUITANG;SHI, CHAOPU;QIAO, YANBO;LUO, XI |
分类号 |
H01L33/52;H01L33/50;H01L33/54 |
主分类号 |
H01L33/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|