发明名称 |
Apparatus and method for semiconductor chip detachment |
摘要 |
<p>An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved</p> |
申请公布号 |
EP1596422(B1) |
申请公布日期 |
2012.08.01 |
申请号 |
EP20050076097 |
申请日期 |
2005.05.10 |
申请人 |
ASM ASSEMBLY AUTOMATION LTD. |
发明人 |
CHEUNG, YIU MING;LIU, CHOU KEE, PETER;YIU, CHING HONG;CHONG, CHI MING |
分类号 |
H01L21/00;H01L21/67;H01L21/301;H01L21/52;H01L21/68 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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