Heat dissipation device with self-locking base

摘要

A heat dissipation device for dissipation of heat from an electronic component includes a base for contacting the electronic component, a shroud connected to the base and multiple fins arranged on the bottom section of the shroud. The shroud comprises a bottom section defining an opening therein and a plate within the opening and connected to the bottom section by multiple beams. Multiple fins in the form of a fin assembly are mounted on the bottom section. The base includes a plate and multiple latch hooks extending upwardly from the plate. The latch hooks are extended into the bottom section to lock with the bottom section, thereby securing the base onto the shroud.