| 摘要 |
A method for manufacturing a microelectronic package (1) comprises the steps of providing two parts (13, 14) comprising electrically insulating material such as plastic; providing members (21, 22, 23) comprising electrically conductive material; providing a microelectronic device (30); positioning the electrically conductive members (21, 22, 23) and the microelectronic device (30) on the electrically insulating parts (13, 14); and placing the electrically insulating parts (13, 14) against each other, wherein the microelectronic device (30) and portions of the electrically conductive members (21, 22, 23) are sandwiched between the electrically insulating parts (13, 14). The electrically conductive members (21, 22, 23) are intended to be used for realizing contact of the microelectronic device (30) arranged inside the package (1) to the external world. An important advantage of the method having steps as mentioned is that the electrically conductive members (21, 22, 23) as such are provided, wherein it is not necessary to provide a conventional lead frame which has the disadvantage of causing considerable waste of metal material during its manufacturing process.
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