Process and apparatus for wafer-level flip-chip assembly

摘要

A method of forming an integrated circuit structure is provided. The method includes providing an interposer wafer; mounting the interposer wafer onto a handling wafer; thinning a backside of the interposer wafer; removing the handling wafer from the interposer wafer after the step of thinning; securing the interposer wafer on a fixture; and bonding a die on the interposer wafer.