发明名称 |
Package systems having a conductive element through a substrate thereof and manufacturing methods of the same |
摘要 |
A package system includes a first substrate structure including at least one first conductive structure that is disposed over a first substrate. A second substrate structure includes a second substrate. The second substrate structure is bonded with the first substrate structure. The at least one first conductive structure is electrically coupled with the second substrate through at least one germanium-containing layer.
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申请公布号 |
US8232614(B1) |
申请公布日期 |
2012.07.31 |
申请号 |
US201113042733 |
申请日期 |
2011.03.08 |
申请人 |
CHU CHIA-HUA;CHANG KUEI-SUNG;LIN CHUNG-HSIEN;HUNG CHIA-MING;PENG JUNG-HUEI;TSAI YI HENG;LEE JIOU-KANG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHU CHIA-HUA;CHANG KUEI-SUNG;LIN CHUNG-HSIEN;HUNG CHIA-MING;PENG JUNG-HUEI;TSAI YI HENG;LEE JIOU-KANG |
分类号 |
H01L21/52 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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