METHOD FOR MANUFACTURING WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING WIRING BOARD HAVING AN ELECTRONIC COMPONENT

摘要

PURPOSE: A method for manufacturing a wiring board for mounting an electronic component, the wiring board for mounting the electronic component, and a method for manufacturing the wiring board with the electronic component are provided to prevent adjacent solders from contacting with each other by connecting the electronic component to the wiring substrate through the re-melting of the solder. CONSTITUTION: An adhesive with electrical insulation materials of a solder and resin agents is arranged on a terminal pad(17). The electrical insulation materials are softened and the solder is melt by heating the adhesive. A solder bump(9) is formed by solidifying the solder. An electrical insulation surface layer(45) is formed by hardening the electrical insulation materials on the surface of a laminate substrate(5) around the solder bump and the surface of the solder bump.