METHOD OF FORMING A WAFER MAP

摘要

PURPOSE: A method for forming a wafer map is provided to reduce time for an electrical and optical inspection of a light emitting device by automatically generating the wafer map based on information about each die. CONSTITUTION: A reference image about a die on which a light emitting device is formed is obtained(S100). An image about a wafer including a plurality of dies is obtained(S110). Dies are classified into a checking target dies and non-target dies by comparing the images with the reference image(S120). A wafer map is generated by using the information about the classified dies(S130).