| 摘要 |
An adhesive attachment (26) is provided for securely mounting an attachment component (20) such as a threaded stud (20) or the like on the surface of a selected substrate, wherein the adhesive attachment (26) provides an electrically conductive ground path for grounding the attachment component and/or a selected structure mounted thereto to the substrate. In one preferred form, the attachment component is a threaded element (20) such as a stud or nut. Upon mounting of the attachment component on the substrate and subsequent connection of the threaded element to a mating threaded member, e.g., of the selected structure to be mounted onto the attachment component, a conductive ground pin (18) is pressed into electrical contact with the substrate for grounding the attachment component and/or the selected structure mounted thereto. |
