LED PACKAGE

摘要

PURPOSE: An LED package is provided to reduce a unit cost of an LED package by reducing a use amount of a fluorescent material. CONSTITUTION: An LED chip(140) and a resin layer are mounted on a substrate(150). The resin layer comprises a transparent silicon layer(110) and a first fluorescent material layer(120) to which the LED chip is applied. A first fluorescent material layer includes a yellow series fluorescent substance of 2wt% to 3.5wt%. The resin layer includes a second phosphor layer laminated on an upper portion of the first fluorescent material layer. A second fluorescent material layer includes a red series fluorescent substance of 0.03wt% to 0.3wt%.