LED PACKAGE AND METHOD FOR MANUFACTURING LED PACKAGE

摘要

PURPOSE: An LED package and a manufacturing method thereof are provided to produce an LED package array of high density by freely selecting a size or a shape of a heat dissipation slug. CONSTITUTION: An LED chip is installed in a main body(110) of a ceramic material. A filling space is located in a lower portion of the LED chip. The filling space includes a first space and a second space prepared inside the main body. The second space has a smaller opening area than the first space is communicated with the first space through an upper side of the main body. A heat dissipation slug(130) is hardened after being filled in the filling space in a liquid or paste state and emits heat generated from the LED chip.