INTEGRATED CIRCUIT PACKAGING SYSTEMWITH PAD CONNECTION AND METHOD OFMANUFACTURE THEREOF

摘要

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD OF MANUFACTURE THEREOFA method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead bottom side and a lead top side; applying a passivation over the lead with the lead top side exposed from the passivation; forming an interconnect structure directly on the passivation and the lead top side, the interconnect structure having an inner pad and an outer pad with a recess above the lead top side; mounting an integrated circuit over the inner pad and the passivation; and molding an encapsulation over the integrated circuit.(Fig. 1)