METHOD FOR FABRICATING BOTH SIDE COPPER CLAD LAMINATE USING CASTING AND SPUTTERING

摘要

PURPOSE: A method for manufacturing double-sided copper clad laminating plate using casting and sputtering is provided to obtain the electrical performance of a first coating layer, a polyimide layer, a Ni / Cr seed layer, and a circuit and to improve adhesive force. CONSTITUTION: A method for manufacturing double-sided copper clad laminating plate using casting and sputtering includes next steps. An insulating layer is hardened in a state of being casted on a first coating layer(S100). Ni and Cr alloy targets are sputtered on the insulating layer to form a Ni/Cr seed layer(S110). A Cu sputtering layer is formed on the Ni/Cr seed layer to enable an electroplating(S120). A second layer is formed on the Cu sputtering layer.