| 摘要 |
<p>AbstractMethod for the simultaneous material-removing processing of both sides of at least three semiconductor wafersThe invention relates to a method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers between two rotating ring-shaped working disks of a double-side processing apparatus, wherein the double-side processing apparatus has a rolling apparatus, which causes at least three carriers to rotate, and wherein each of the carriers has precisely one opening, into which a semiconductor wafer is respectively inserted in a freely movable fashion, such that the semiconductor wafers are moved on a cycloidal trajectory between the working disks, wherein the arrangement of the carriers in the double-side processing apparatus and of the openings in the carriers is such that the inequality[err]is satisfied, where N[err] denotes the ratio of the round angle and the angle at which the adjacent carriers are inserted into the rolling apparatus with the greatest distance with respect toone another, r denotes the radius of an opening for receiving a semiconductor wafer, e denotes the radius of the pitch circlearound the midpoint of the carrier on which the opening is arranged, and R denotes the radius of the pitch circle on whichthe carriers move between the working disks by means of therolling apparatus. Fig. 1</p> |
