SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

摘要

PURPOSE: A substrate processing method and an apparatus thereof are provided to remove foreign materials from a surface of a semiconductor mold with a brush revolving and vibrating. CONSTITUTION: A cooling gas discharge nozzle(7) is arranged on an upper portion of an initial position(P(Rin)) on a substrate(W). Cooling gas is supplied to the initial position of a rotating substrate and DIW(Deionized Water: coagulation object liquid) attached to an initial area including the initial position and a rotation center area coagulates. All DIW attached to the substrate surface is coagulated by broadening a coagulation area in the outside of the substrate and the entire of a liquid film(LF) is frozen along with initial coagulation area formation.