发明名称 POST DEPOSITION WAFER CLEANING FORMULATION
摘要 Methods and systems for cleaning corrosion product of a metallic capping layer from the surface of a substrate are provided. According to one embodiment, a treatment solution includes a surfactant, a complexing agent, and a pH adjuster. The surfactant is configured to enhance wetting of the substrate surface, and inhibit further corrosion of the capping layer. The complexing agent is configured to bind to metal ions which have desorbed from the substrate surface. The pH adjuster is configured to adjust the pH to a desired level, so as to promote desorption of the corrosion product from the substrate surface.
申请公布号 SG181854(A1) 申请公布日期 2012.07.30
申请号 SG20120045845 申请日期 2010.12.10
申请人 LAM RESEARCH CORPORATION 发明人 KOLICS, ARTUR
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