SEMICONDUCTOR DEVICE AND METHOD OF FORMINGINTEGRATED PASSIVE DEVICE OVER SEMICONDUCTOR DIE WITH CONDUCTIVE BRIDGE AND FAN-OUT REDISTRIBUTION LAYER

摘要

Abstract SEMICONDUCTOR DEVICE AND METHOD OF FORMING INTEGRATED PASSIVE DEVICE OVER SEMICONDUCTOR DIE WITH CONDUCTIVE BRIDGE AND FAN—OUT REDISTRIBUTION LAYERA semiconductor device has a first semiconductor die. A first inductor is formed over the first semiconductor die. A second inductor is formed over the first inductor and aligned with the first inductor. An insulating layer is formed over the first semiconductor die and the first and second inductors. A conductive bridge is formed over the insulating layer and electrically connected between the second inductor and the first semiconductor die. In one embodiment, the semiconductor device has a second semiconductor die and a conductive layer is formed between the first and second semiconductor die. In another embodiment, a capacitor is formed over the first semiconductor die. In another embodiment, the insulating layer has a first thickness over a footprint of the first semiconductor die and a second thickness less than the first thickness outside the footprint of the first semiconductor die.(Fig. 6)