| 摘要 |
<p>PURPOSE: A dicing film is provided to improve manufacturing efficiency by omitting a process attaching a die bond film and to be attached to a semiconductor wafer without dislocation. CONSTITUTION: A dicing film(11) comprises a base material(1) and an adhesive layer(2). The adhesive layer is laminated on the base material. An embossing process is executed to the base material. The base material is tinted. A die bond film(3) is laminated on the adhesive layer of the dicing film. A protection film(14) is attached to the dicing film. The penetration ration of the protection film is 75% to 100%. The penetration ratio of the dicing film in which the protection film is attached is 0% to 75%.</p> |
