发明名称 |
Laminated Electronic Card Assembly |
摘要 |
An electronic card is assembled from top and bottom graphic layers, top and bottom thermal sensitive adhesion tapes and an inlay assembly laminated together. The inlay assembly is made of a sub-assembly of a PCB base with one or more electronic components mounted to it, thermal sensitive adhesion tape and a stiffening substrate, all laminated together, while a battery insert and possible additional inserts made of PVC are mounted in openings in the sub-assembly around electronic components such as the battery. The stiffening substrate has a thermal coefficient substantially the same as that of the PCB base. The card need not contain any solder connections and is ISO 7810 compliant. Lamination is performed at a warm, not hot, temperature that does not damage the battery or melt any components together.
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申请公布号 |
US2012188732(A1) |
申请公布日期 |
2012.07.26 |
申请号 |
US201213438700 |
申请日期 |
2012.04.03 |
申请人 |
POIDOMANI MARK;ZIEGLER JOAN;FOO ERIC;ALON ZIV;MCGUIRE CHARLES;ROUTHENSTEIN LAWRENCE;PRIVASYS, INC. |
发明人 |
POIDOMANI MARK;ZIEGLER JOAN;FOO ERIC;ALON ZIV;MCGUIRE CHARLES;ROUTHENSTEIN LAWRENCE |
分类号 |
H05K7/00;B32B37/12;B32B37/14 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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