发明名称 Laminated Electronic Card Assembly
摘要 An electronic card is assembled from top and bottom graphic layers, top and bottom thermal sensitive adhesion tapes and an inlay assembly laminated together. The inlay assembly is made of a sub-assembly of a PCB base with one or more electronic components mounted to it, thermal sensitive adhesion tape and a stiffening substrate, all laminated together, while a battery insert and possible additional inserts made of PVC are mounted in openings in the sub-assembly around electronic components such as the battery. The stiffening substrate has a thermal coefficient substantially the same as that of the PCB base. The card need not contain any solder connections and is ISO 7810 compliant. Lamination is performed at a warm, not hot, temperature that does not damage the battery or melt any components together.
申请公布号 US2012188732(A1) 申请公布日期 2012.07.26
申请号 US201213438700 申请日期 2012.04.03
申请人 POIDOMANI MARK;ZIEGLER JOAN;FOO ERIC;ALON ZIV;MCGUIRE CHARLES;ROUTHENSTEIN LAWRENCE;PRIVASYS, INC. 发明人 POIDOMANI MARK;ZIEGLER JOAN;FOO ERIC;ALON ZIV;MCGUIRE CHARLES;ROUTHENSTEIN LAWRENCE
分类号 H05K7/00;B32B37/12;B32B37/14 主分类号 H05K7/00
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