MANUFACTURING PROCESS OF SN OR SAC NANO SOLDER PASTE WITH LOW MELTING TEMPERATURE AND THE SOLDER PASTE MANUFACTURED BY THE METHOD
摘要
PURPOSE: Solder paste having a low melting point and a manufacturing method thereof using nano Sn or Sn-Ag-Cu particles are provided to reduce energy consumption for processes by using nano-particulate solder paste to lower a melting point. CONSTITUTION: A method for manufacturing solder paste having a low melting point using nano Sn or Sn-Ag-Cu particles comprises the steps of: making nano Sn or Sn-Ag-Cu particles using DCA(Direct Current Arc), maintaining the nano particles at high concentration through centrifugal separation, and mixing the high-concentration nano particles with flux by ultrasonic waves to obtain paste.
申请公布号
KR101166790(B1)
申请公布日期
2012.07.26
申请号
KR20120012136
申请日期
2012.02.07
申请人
ISP. CO., LTD.;KIM, JONG CHUL;CHO, KYUNG JIN;LEE, JONG HYUN;JANG, SEOK PIL;KIM, YEONG KOOK;KIM, HYUN JIN;KIM, HEE SANG
发明人
KIM, JONG CHUL;CHO, KYUNG JIN;KIM, HEE SANG;JANG, SEOK PIL;KIM, YEONG KOOK;KIM, HYUN JIN;LEE, JONG HYUN