SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package capable of improving reliability, and its manufacturing method.

SOLUTION: A semiconductor package 1 comprises: a package substrate 80; and a chip laminate 10 implemented on the package substrate 80. The chip laminate 10 and the package substrate 80 are electrically connected via a solder ball 110 arranged between the package substrate 80 and a first semiconductor chip 100 of the chip laminate 10. A second semiconductor chip 200 is laminated on the first semiconductor chip 100. A top surface 200s of the second semiconductor chip 200 is exposed without being covered with a flat molding film 350, and directly contacts with a heat dissipation film 401. Therefore, heat generated in the first semiconductor chip 100 and the second semiconductor chip 200 is easily dissipated through the heat dissipation film 401.

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