发明名称 PRESSURE SENSITIVE ADHESIVE COMPOSITION FOR DICING DIE BONDING FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a pressure sensitive adhesive composition for a dicing die bonding film, the adhesive strength to a ring frame of which is improved by containing an acrylic copolymer having a phosphoric acid group and/or a silane group and which has an excellent pickup success rate. <P>SOLUTION: The pressure sensitive adhesive composition includes the acrylic copolymer having one or more selected from groups composed of an alkyl group and a hydroxy group and one or more selected from groups composed of a phosphoric acid group and a silane group and a curing agent, wherein the curing agent of 3 to 10 pts.mass is contained in 100 pts.mass of the acrylic copolymer. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012140591(A) 申请公布日期 2012.07.26
申请号 JP20110228950 申请日期 2011.10.18
申请人 CHEIL INDUSTRIES INC 发明人 HA KYOUNG JIN;PARK BAEK SOUNG;KIM JI HO;HWANG MIN KYU;RI KICHISEI
分类号 C09J133/00;B32B27/00;B32B27/30;C09J7/02;C09J11/00;H01L21/301 主分类号 C09J133/00
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