摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pressure sensitive adhesive composition for a dicing die bonding film, the adhesive strength to a ring frame of which is improved by containing an acrylic copolymer having a phosphoric acid group and/or a silane group and which has an excellent pickup success rate. <P>SOLUTION: The pressure sensitive adhesive composition includes the acrylic copolymer having one or more selected from groups composed of an alkyl group and a hydroxy group and one or more selected from groups composed of a phosphoric acid group and a silane group and a curing agent, wherein the curing agent of 3 to 10 pts.mass is contained in 100 pts.mass of the acrylic copolymer. <P>COPYRIGHT: (C)2012,JPO&INPIT |