发明名称 METHOD OF FORMING WIRING AND ELECTRODE USING METAL NANO PASTE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of forming wiring and an electrode using a metal nano paste. <P>SOLUTION: A method of forming metal wiring and an electrode includes a sintering process comprising: placing a substrate on which a metal nano paste is printed in a furnace and raising a temperature of the furnace to 220 to 240&deg;C under a nitrogen atmosphere; heating the substrate under a mixed atmosphere of carboxylic acid and air while the temperature of the furnace is maintained in the above temperature range; dropping the temperature of the furnace to 100 to 150&deg;C under the mixed atmosphere of carboxylic acid and air; and dropping the temperature of the furnace to room temperature under a nitrogen atmosphere. Accordingly, even after a low-temperature sintering process, a metal film has a high density and a minimized amount of residual metal particles as is the case in a high-temperature sintering process. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012142573(A) 申请公布日期 2012.07.26
申请号 JP20110284020 申请日期 2011.12.26
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 JANG SONG-HEE;LEE YON IRU;KIM DONG HOON;KIM SUNG-UN;CHO HIE-JIN
分类号 H05K3/12;H01L21/288;H01L31/04;H05K3/10 主分类号 H05K3/12
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