发明名称 |
METHOD OF FORMING WIRING AND ELECTRODE USING METAL NANO PASTE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming wiring and an electrode using a metal nano paste. <P>SOLUTION: A method of forming metal wiring and an electrode includes a sintering process comprising: placing a substrate on which a metal nano paste is printed in a furnace and raising a temperature of the furnace to 220 to 240°C under a nitrogen atmosphere; heating the substrate under a mixed atmosphere of carboxylic acid and air while the temperature of the furnace is maintained in the above temperature range; dropping the temperature of the furnace to 100 to 150°C under the mixed atmosphere of carboxylic acid and air; and dropping the temperature of the furnace to room temperature under a nitrogen atmosphere. Accordingly, even after a low-temperature sintering process, a metal film has a high density and a minimized amount of residual metal particles as is the case in a high-temperature sintering process. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012142573(A) |
申请公布日期 |
2012.07.26 |
申请号 |
JP20110284020 |
申请日期 |
2011.12.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
JANG SONG-HEE;LEE YON IRU;KIM DONG HOON;KIM SUNG-UN;CHO HIE-JIN |
分类号 |
H05K3/12;H01L21/288;H01L31/04;H05K3/10 |
主分类号 |
H05K3/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|