MULTILAYER WAFER, RESIN SEALING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To inhibit generation of voids and contamination of a wafer in filling an underfill between wafers of a multilayer wafer at the wafer level.

SOLUTION: A frame-like outflow prevention structure 120 and one or more guide structures 130 arranged in the outflow prevention structure 120 are formed on at least one of wafers 100 and 100'. After stacking the wafers 100 and 100' so as to sandwich the structures 120 and 130, an underfill is filled in a gap surrounded by the outflow prevention structure 120 between the wafers 100 and 100'. Each of the wafers has a chip formation region 110 on which a semiconductor chip is formed, and the outflow prevention structure 120 is formed so as to surround the chip formation region 110 and have an inlet 221 and a flow outlet 222 of resin. The guide structure 130 is provided so as to form a plurality of resin passages 241-245 arranged in parallel between the inlet 221 and the flow outlet 222.

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