| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a novel device for supporting a semiconductor wafer or a substrate. <P>SOLUTION: A substrate container comprises a housing which encloses a substrate. The housing has a container door to access the inside of an enclosure of the housing. A support structure arranged in the housing has a plurality of tines which extend into the enclosure. Each of the tines has an outer edge. A plurality of tines are arranged in the horizontal direction. Protruding portions of the substrate extend over the outer edges of the tines and form an access region to engage with the substrate. The tines include support pads to support the substrate. One of the support pads of one of the tines is arranged on one side of the access region, and another one of the support pads of the tine is arranged on the other side of the access region. <P>COPYRIGHT: (C)2012,JPO&INPIT |
