发明名称 LOW TEMPERATURE ALD SiO2
摘要 <P>PROBLEM TO BE SOLVED: To provide a methods for depositing silicon dioxide by atomic layer deposition in general, where pyridine is provided as a catalyst so that water can be utilized as an oxidization source while depositing at a low temperature. <P>SOLUTION: Prior to exposing a substrate to water, the substrate may be exposed to a pyridine soak process 320. Additionally, the water may be co-flowed to a chamber with pyridine through separate conduits to reduce interaction prior to entering the chamber. Alternatively, the pyridine may be co-flowed with a silicon precursor that does not react with pyridine. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012142611(A) 申请公布日期 2012.07.26
申请号 JP20120086105 申请日期 2012.04.05
申请人 APPLIED MATERIALS INC 发明人 MAHAJANI MAITREYEE;HUANG YI-CHIAU;MCDOUGALL BRENDAN
分类号 H01L21/318;C23C16/42;C23C16/455 主分类号 H01L21/318
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