发明名称 METHOD FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated electronic component which suppresses variations in thickness of conductive patterns and improves dimensional accuracy of the conductive patterns. <P>SOLUTION: In the method for manufacturing a laminated electronic component having a printing step of forming a plurality of internal electrode patterns PT on a ceramic green sheet 10 with the use of a screen plate 11, the printing step includes positioning the ceramic green sheet 10 and the screen plat 11 at an interval and moving a squeegee 13 pressed against the screen plate 11 from a printing start side to a printing end side, so that a conductive paste P supplied to the screen plate 11 is applied to the ceramic green sheet 10 to form the plurality of internal electrode patterns PT. The total area of a plurality of conductive patterns PT formed on the printing end side is smaller than the total area of a plurality of conductive patterns PT formed on the printing start side. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012142348(A) 申请公布日期 2012.07.26
申请号 JP20100292421 申请日期 2010.12.28
申请人 TDK CORP 发明人 ITANI TOMOKAZU
分类号 H05K3/12;B41F15/08;B41M1/12;B41N1/24 主分类号 H05K3/12
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