发明名称 METHOD OF FORMING A SEMICONDUCTOR DEVICE TERMINATION AND STRUCTURE THEREFOR
摘要 At least one exemplary embodiment is directed to a semiconductor edge termination structure, where the edge termination structure comprises several conductivity layers and a buffer layer.
申请公布号 US2012187526(A1) 申请公布日期 2012.07.26
申请号 US201113011590 申请日期 2011.01.21
申请人 发明人 ROIG-GUITART JAUME;HOSSAIN ZIA;MOENS PETER
分类号 H01L23/58;H01L21/761 主分类号 H01L23/58
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