发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE MATERIAL COMPRISING THE SAME
摘要 The present invention relates to a photosensitive resin composition and a photosensitive material comprising the same. The photosensitive resin composition according to an exemplary embodiment of the present invention may comprise two multi-functional monomers where structures of side chains comprising unsaturated double bonds are different from each other while a composition ratio is changed. Accordingly, in the exemplary embodiment of the present invention, processability is excellent, and it is possible to decrease defects by a rupture when a LCD substrate is sealed and substrate separation defects due to an impact to the LCD products by improving an adhesion property to a lower substrate after a hard baking process.
申请公布号 US2012189961(A1) 申请公布日期 2012.07.26
申请号 US201213353066 申请日期 2012.01.18
申请人 JI HO CHAN;KIM SUNGHYUN;CHOI DONGCHANG;CHOI KYUNG SOO;CHA GEUN YOUNG;LEE SANG CHUL;LG CHEM, LTD. 发明人 JI HO CHAN;KIM SUNGHYUN;CHOI DONGCHANG;CHOI KYUNG SOO;CHA GEUN YOUNG;LEE SANG CHUL
分类号 G03F7/20;G03F7/032 主分类号 G03F7/20
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