PACKAGING SYSTEM FOR PROTECTION OF IC WAFERS DURING FABRICATION, TRANSPORT AND STORAGE

摘要

The packaging system includes an enclosure (20, 30) having an interior volume. A wafer stack (26), comprising plural wafers (25) and separators (27) in contact with the wafers, is located in the interior volume. The separators have raised bumps (27a, 27b) extending from each side. The bumps create spaces (28b) that allow air to flow therethrough. The separator film intercepts and captures airborne molecular contaminants belonging to organic and inorganic chemical families. In addition, the film is dissipative to static discharge. Furthermore, the bumps provided by the separators protect the fragile wafers from damage due to mechanical shock. The separators are also provided with a peripheral ring (27c) or embossment, which contacts the wafer edges and further protects the wafers from damage to mechanical shock. Air cushions (23) can be provided in the wafer stack, which cushions are provided with bands (41) to regulate the compression.