| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique for increasing the density of external connection terminals in an element mounting substrate for vertical mounting. <P>SOLUTION: An element mounting substrate 100 for vertical mounting includes: first to fourth insulating resin layers 116, 122, 128 and 134; first to sixth wiring layers 112, 114, 118, 124, 130 and 136 formed on a main surface of each of the insulating resin layers; and via conductors 120, 126, 132 and 138, penetrating through the first to fourth insulating resin layers 116, 122, 128 and 134, respectively, electrically connected to any one of the first to sixth wiring layers 112, 114, 118, 124, 130 and 136, and exposed on a side end face 104 of the element mounting substrate 100 to function as an external connection terminal 106. <P>COPYRIGHT: (C)2012,JPO&INPIT |
