发明名称 SEMICONDUCTOR CHIP MANUFACTURING METHOD AND SEMICONDUCTOR WAFER DIVISION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor chip manufacture method which allows a semiconductor chip used in a face-down (FD) mounting to be more easily manufactured. <P>SOLUTION: A manufacturing method of a light-emitting element 20 as an example of a semiconductor element comprises: a semiconductor element formation step of forming the light-emitting element 20 on a substrate 10; a protruded electrode formation step of forming a first protruded electrode 210 on a first electrode 170 and a second protruded electrode 220 on a second electrode 180 of the light-emitting element 20; a brittle region formation step (FIG.7(a)) of forming a brittle region 321 in a division scheduled surface of the substrate 10; and a division step (FIG.7(b) and (c)) of dividing a wafer 30 in which the light-emitting element 20 is formed on the substrate 10 into light-emitting chips 1 starting at the brittle region 321. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012142401(A) 申请公布日期 2012.07.26
申请号 JP20100293549 申请日期 2010.12.28
申请人 SHOWA DENKO KK 发明人 OKABE TAKEHIKO;HIRAIWA DAISUKE
分类号 H01L21/301;H01L33/32 主分类号 H01L21/301
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