摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip manufacture method which allows a semiconductor chip used in a face-down (FD) mounting to be more easily manufactured. <P>SOLUTION: A manufacturing method of a light-emitting element 20 as an example of a semiconductor element comprises: a semiconductor element formation step of forming the light-emitting element 20 on a substrate 10; a protruded electrode formation step of forming a first protruded electrode 210 on a first electrode 170 and a second protruded electrode 220 on a second electrode 180 of the light-emitting element 20; a brittle region formation step (FIG.7(a)) of forming a brittle region 321 in a division scheduled surface of the substrate 10; and a division step (FIG.7(b) and (c)) of dividing a wafer 30 in which the light-emitting element 20 is formed on the substrate 10 into light-emitting chips 1 starting at the brittle region 321. <P>COPYRIGHT: (C)2012,JPO&INPIT |