LAMINATE STRUCTURED SEMICONDUCTOR DEVICE HAVING THROUGH ELECTRODE, SEMICONDUCTOR MEMORY DEVICE, SEMICONDUCTOR MEMORY/SYSTEM, AND OPERATION METHOD OF THE SEMICONDUCTOR MEMORY/SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a laminated structured semiconductor device having a through electrode, a semiconductor memory device, a semiconductor memory/system, and an operation method of the semiconductor memory/system.

SOLUTION: A semiconductor device has a structure which prevents collisions of information transmitted between multiple semiconductor layers. The semiconductor device comprises: at least one first semiconductor chip including a first temperature sensor circuit outputting first temperature information; a first bump which is not electrically connected with the through electrode and is electrically connected with the first temperature sensor circuit; and a second bump which is electrically connected with the through electrode of the first semiconductor chip.

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