发明名称 METHOD AND APPARATUS FOR ENHANCED COOLING OF MOBILE COMPUTING DEVICE SURFACES
摘要 An apparatus with some embodiments is described having ducts positioned above and below a main device housing to provide cooling air flow to at least a portion of the top and bottom surfaces of the associated computing device. In some embodiments, the device is a mobile computing device. In some embodiments, air may be drawn through inlets located on at least one side of the device. The inlet air may be supplied via upper and lower air ducts to an air mover positioned on an opposite side of the device. In some embodiments, air discharged from the air mover may be supplied to a main housing of the device in which heat producing components may be located. Other embodiments are described.
申请公布号 WO2012040706(A3) 申请公布日期 2012.07.26
申请号 WO2011US53264 申请日期 2011.09.26
申请人 INTEL CORPORATION;MACDONALD, MARK 发明人 MACDONALD, MARK
分类号 G06F1/20;G06F1/16;H05K7/20 主分类号 G06F1/20
代理机构 代理人
主权项
地址