| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent dew condensation on a substrate and to avoid the occurrence of a failure such as pattern collapse even in the case that heat of the substrate is taken away by evaporation of fluid supplied to the substrate and thus the temperature of the substrate can be turned to be lower than an ambient dew point temperature. <P>SOLUTION: A fluid supply device 1 includes: a holding section 12 for holding a substrate 2 to be a processing object; a fluid supply section 30 for supplying fluid 31 to the substrate 2 held by the holding section 12; and a medium supply section 40 for supplying, to the substrate 2, a heat loss compensation medium 41 for compensating heat loss of the substrate 2 so as to turn the substrate 2 whose heat is taken away by the evaporation of the fluid 31 to a higher temperature than the ambient dew point temperature. <P>COPYRIGHT: (C)2012,JPO&INPIT |
